Genie Nano-CXP cameras are built with a CoaXPress v1.1, GeniCam GenCP compliant interface that employs 6Gbps technology to achieve breakthrough speed. They are suitable for a wide range of machine vision applications, including semiconductor wafer inspection, surface and bump inspection, electronics manufacturing, 3D solder paste inspection, automated Optical Inspection (AOI), and solar panel inspection.
Genie Nano-CXP CoaXPress Cameras Features
Nano-CXP-M8200 | Nano-CXP-C8200 Camera Features
Manufacturer: | Teledyne DALSA | Model: |
Nano-CXP-M8200 Nano-CXP-C8200 |
Total Pixels: | 67,108,864 |
Resolution: | 8192 (h) 8192 (v) | Sensor Size: | APS-C | Color/B & W: | Color / Monochrome |
Frame Rate (fps): | 30 | Sensor Type: | CMOS | Sensor Device: | e2v Emerald 67M |
Pixel Size(µm): | 2.5(h) 2.5(v) | A/D Bits: | 10 | Shutter Speed: | 14 µs to 10 sec |
Interface: | CoaXPress | Voltage(VDC): | 12-24V | Power(watts): | 13 |
Lens Mount: | M42 | Shutter Type: | Global | Weight(grams): | 163 |
S/N Ratio(dB): | 37.8 | External Trigger: | Yes | Dimensions(mm): | 32Lx59Wx59H |